High Temperature Plus Resin
SUNLU High Temperature Plus Resin is an engineering-grade resin with a heat deflection temperature up to 170°C. It can withstand temperatures up to 300°C for 3 minutes without deformation, designed for high-temperature functional applications.
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High Heat Deflection Temperature: 170°C
The material features a high heat deflection temperature of up to 170°C, maintaining structural stability even under prolonged heat exposure. It is suitable for printing functional components in high-temperature environments, offering reliable and durable performance.
Short-Term Heat Resistance up to 300°C
The material performs excellently under extreme high-temperature conditions, maintaining its shape and integrity even when exposed to temperatures of 300°C for a short duration (approximately 3 minutes). It meets the requirements for high-temperature testing and use in special working conditions.
High Hardness for Mold Verification
The material exhibits excellent hardness, providing sturdy and stable printed structures. It meets the demands for mold validation, structural testing, and the printing of functional components, offering reliable support for engineering applications.
Parameter Information
| Mechanical Properties | Physical Properties | Print Settings | |||
|---|---|---|---|---|---|
| Tensile Strength（MPa） | 32 | Resin viscosity（mPa.s/℃） | 200-500 | Bottom number | 5-10 |
| Flexural Strength（MPa） | 82 | Mold Shrinkage（%） | 8 | Bottom exposure time | Color LCD: 7-70s Monochrome LCD: 3.5–40s |
| Notched Izod Impact Strength（J/m） | 25 | Heat Deflection Temperature（℃） | 170 | Layer exposure time | Color LCD: 3–15s Monochrome LCD: 2–3.5s |
| Elongation at Break（%） | 7 | Lifting speed | 60-120mm/min | ||
| Shore Hardness（HA/HD） | 87 | ||||