High Temperature Plus Resin
SUNLU High Temperature Plus Resin is an engineering-grade resin with a heat deflection temperature up to 170°C. It can withstand temperatures up to 300°C for 3 minutes without deformation, designed for high-temperature functional applications.
Recommended Printing Parameters
| Project | 25–30℃ |
| Print layer thickness | 0.05mm |
| Bottom layer count | 5–10 layers |
| Bottom layer exposure time | RGB LCD Screen：7–70s / Monochrome LCD Screen 3.5–40s |
| layer exposure time | RGB LCD Screen：3–15s / Monochrome LCD Screen 2–3.5s |
| Cleaning method | Ultrasonic cleaning with 95% ethanol or IPA for 3–5 minutes |
| Curing time | 5-10 minutes |
1. High Heat Deflection Temperature: 170°C: Suitable for printing functional parts in high-temperature environments.
2. Short-Term Heat Resistance up to 300°C: Models remain stable without deformation or cracking even after 3 minutes at 300°C.
3. High Hardness for Mold Verification: Durable and rigid, ideal for mold validation and functional components.
Must be fully cured;
Avoid overexposure;
Insufficient curing affects heat resistance;
Store away from light.